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1.0mm, wire diameter 0.5mm test point SMD pad rectangle square SMD pads Net tie, 4 pin, Right Angle, Bayonet, 50Ohm, 4GHz, https://www.te.com/commerce/DocumentDelivery/DDEController?Action=showdoc&DocId=Customer+Drawing%7F1478035%7FB1%7Fpdf%7FEnglish%7FENG_CD_1478035_B1.pdf%7F1-1478035-0 BNC RF Interface, PCB mount 4 pin, 1.0mm round THT pads Net tie, 3 pin, 0.5mm square SMD pads Net tie, 2 pin, 1.0mm round THT pads Net tie, 4 pin, 2.0mm square SMD rectangular pad as test Point, square 1.5mm side length test point wire loop as test Point, diameter 4.0mm, hole diameter 1.3mm, wire diameter 0.8mm Test point with 2 copper strips net tie solder jumper bridged SMD Solder Jumper, 1x1.5mm Pads, 0.3mm gap, open SMD Solder 3-pad Jumper, 1x1.5mm Pads, 0.3mm gap, bridged with 1 copper strip SMD 1x22 2.00mm single row Through hole straight pin header, 1x40, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Through hole pin header THT 2x04 1.27mm double row SMD IDC box header 2x30 2.54mm double row.

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