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Dual BNC Amphenol Horizontal Panel-mountable BNC connector mounted through PCB, vertical BNC RF Interface, PCB mount 4 pin, 2.0mm square SMD pads Net tie, 4 pin, 0.3mm round THT pads Net tie, 3 pin, 0.3mm round THT pads Net tie, 2 pin, 0.5mm square SMD pads Net tie, 4 pin, 1.0mm round THT pads Net tie, 2 pin, 0.5mm square SMD rectangular pad as test point, loop diameter 1.8mm, hole diameter 1.3mm, hole diameter 1.2mm THT pad as test Point, diameter 4.0mm Plated Hole as test Point, square 3.0mm side length test point wire loop as test point, pitch 5.08mm, size 61x9.8mm^2, drill diamater 1.3mm, pad diameter 1.4mm, outer diameter 1.5mm, size source Multi-Contact FLEXI-xV 2.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times 1 mm² wires, basic insulation, conductor diameter 2mm, size source Multi-Contact FLEXI-xV 1.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times 0.25 mm² wires, reinforced insulation, conductor diameter 2mm, outer diameter 1.5mm, hole diameter 1.3mm, hole diameter 0.9mm wire loop wire loop as test point, loop diameter 1.8mm, 2 pins diameter 3.0mm z-position of LED center 3.0mm, 2 pins Rectangular size 4.5x1.6mm^2 2 pins Ceramic Resomator/Filter Murata CDSCB, http://cdn-reichelt.de/documents/datenblatt/B400/SFECV-107.pdf, 4.5x2.0mm^2 package SMD Crystal G8, hand-soldering, 3.2x1.5mm^2 package SMD Crystal Oscillator Seiko Epson SG-8002JA https://support.epson.biz/td/api/doc_check.php?mode=dl&lang=en&Parts=SG-8002DC, 14.0x8.7mm^2 package SMD Crystal Oscillator Seiko Epson MC-506 http://media.digikey.com/pdf/Data%20Sheets/Epson%20PDFs/MA-505,506.pdf.

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