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Wafer level chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g483me.pdf ST WLCSP-81, ST die ID.

• Signal hide (31 B.Cu signal.
• 3269P Potentiometer, vertical, Vishay.
• 0.137479 -0.572634 0.808202 vertex.

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