Labels Milestones
BackMount Fuse with Clip, 4.2 x 11.1 mm, Time-Lag T, 250 VAC, 125 VDC (https://us.schurter.com/bundles/snceschurter/epim/_ProdPool_/newDS/en/typ_UMT_250.pdf Surface Mount Package (https://www.fairchildsemi.com/package-drawings/ML/MLSOP08A.pdf Power Integrations K Package PowerPAK SO-8 Dual (https://www.vishay.com/docs/71655/powerpak.pdf, https://www.vishay.com/docs/72600/72600.pdf PowerPAK SO-8 Single (https://www.vishay.com/docs/71655/powerpak.pdf, https://www.vishay.com/docs/72599/72599.pdf 16-Lead Plastic DFN (3mm x 2mm) 0.40mm pitch DDB Package; 8-Lead Plastic Stretched Small Outline (SS)-5.30 mm Body with Exposed Pad (see https://www.diodes.com/assets/Package-Files/SO-8EP.pdf 20-Lead Plastic Thin Quad Flatpack No-Lead Package, 3x3mm Body (see Atmel Appnote 8826 10-Lead Plastic DFN (7mm x 4mm) (see Linear Technology DFN_6_05-08-1703.pdf 6-Lead Plastic Small Outline (SSO/Stretched SO), see https://www.vishay.com/docs/84299/vor1142b4.pdf SSO Stretched SO SOIC Pitch 1.27 SSOP-8 2.9 x2.8mm Pitch 0.65mm HSOP.
- Microchip Packaging Specification 00000049BS.pdf DFN.
- PLCC-6 ASMT-YTB7-0AA02 High Power CSP LED, 2.36mm.