Labels Milestones
BackST WLCSP-115, ST die ID 471, 4.437x4.456mm, 100 Ball, 10x10 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100168.PDF XBGA-121, 11x11 raster, 10x10mm package.
- C1 | 1 uF tantalum\nYuSynth 1, 10.
- USB-B receptacle horizontal through-hole USB_B USB B receptacle.
- Initial kicad project main MK_SEQ/.gitignore 3 lines.