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Type-2 TO-220F-9, Vertical, RM 10.9mm, see https://toshiba.semicon-storage.com/us/product/mosfet/to-247-4l.html TO-247-4 Horizontal RM 2.54mm TO-218-2, Horizontal, RM 2.54mm, staggered type-1 TO-220-7, Horizontal, RM 1.7mm, staggered type-2, see http://www.st.com/resource/en/datasheet/tda7391lv.pdf TO-220-11 Horizontal RM 2.54mm TO-220F-3, Vertical, RM 1.27mm, Multiwatt-7, staggered type-2 TO-220-7, Vertical, RM 1.7mm, PentawattF-, MultiwattF-5 TO-220F-5 Vertical RM 2.54mm staggered type-1 TO-220F-4, Vertical, RM 4.58mm, IPAK, see https://www.diodes.com/assets/Package-Files/TO251.pdf TO-251-3 Horizontal RM 5.08mm TO-220F-2, Vertical, RM 2.54mm, see http://ww1.microchip.com/downloads/en/DeviceDoc/20005685A.pdf TO-247-5 Horizontal RM 5.45mm TO-247-3, Vertical, RM 1.7mm, Pentawatt, Multiwatt-5, staggered type-2, see http://www.st.com/resource/en/datasheet/tda7391lv.pdf TO-220-11 Vertical RM 1.7mm Pentawatt Multiwatt-5 staggered type-2 TO-220F-5 Vertical RM 1.7mm staggered type-2 TO-220F-5 Vertical RM 1.7mm Pentawatt Multiwatt-5 TO-220-5, Vertical, RM 0.97mm, Multiwatt-9, staggered type-2 TO-220F-5, Vertical, RM 1.27mm, Multiwatt-7, staggered type-1 TO-220F-9, Vertical, RM 0.9mm, staggered type-2 TO-220-9 Vertical RM 1.7mm MultiwattF-11 staggered type-2 TO-220F-7, Vertical, RM 2.54mm, see http://www.vishay.com/docs/88898/b2m.pdf DIL DIP PDIP 5.08mm 2.54 4-lead dip package with missing pin 5, row spacing 26.67 mm (1050 mils), SMDSocket, LongPads 12-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), Socket, LongPads THT DIP DIL PDIP 2.54mm 7.62mm 300mil Socket LongPads 22-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 22-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 22-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 32-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size 10.8x19.34mm 7x-dip-switch.

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