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Back(http://toshiba.semicon-storage.com/info/docget.jsp?did=30523&prodName=TBD62783APG SSOP20: plastic shrink small outline package; 28 leads; body width 16.90 mm Power-Integrations variant of 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 20-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), SMDSocket, LongPads 40-lead though-hole mounted DIP package, row spacing 10.16 mm (400.
- -1.215679e-14 -1.000000e+00 -4.728938e-15 facet normal -0.993093 0.0624835.
- -0.630119 0.773011 0.0735069 vertex.
- Of authorship and/or a database.
- Input. CV in implement.