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15.239999999999998mm Bourns 8100 3 Phase, CM Choke, https://vacuumschmelze.com/03_Documents/Datasheets%20-%20Drawings/Commom-Mode-Chokes/6123-X140.pdf 3 Phase, CM Choke, https://vacuumschmelze.com/03_Documents/Datasheets%20-%20Drawings/Commom-Mode-Chokes/6123-X140.pdf 3 Phase, CM Choke, https://vacuumschmelze.com/03_Documents/Datasheets%20-%20Drawings/Commom-Mode-Chokes/6123-X140.pdf 3 Phase, CM Choke, https://vacuumschmelze.com/03_Documents/Datasheets%20-%20Drawings/Commom-Mode-Chokes/6123-X240.pdf Wuerth, WE-CMB, Bauform XL, Wuerth, WE-CMB, Bauform XL, Wuerth, WE-CMB, Bauform XS, Wuerth, WE-CMB, Bauform S, Wuerth, WE-CMB, Bauform S, Wuerth, WE-CMB, Bauform XL, Wuerth, WE-CMB, Bauform M, Wuerth, WE-CMB, Bauform XL, Wuerth, WE-CMB, Bauform M, Wuerth, WE-CMB, Bauform S, Wuerth, WE-CMB, Bauform XL, Wuerth, WE-CMB, Bauform XS, Wuerth, WE-CMB, Bauform M, Wuerth, WE-CMB, Bauform XXL, Lodestone Pacific, 64.51mm diameter vertical toroid mount, 16AWG/1.27mm holes, http://www.lodestonepacific.com/CatKpdf/VTM_Series.pdf Lodestone Pacific, 64.51mm diameter vertical toroid mount, 16AWG/1.27mm holes, http://www.lodestonepacific.com/CatKpdf/VTM_Series.pdf Lodestone Pacific, 40.64mm diameter vertical toroid mount, 16AWG/1.27mm holes, http://www.lodestonepacific.com/CatKpdf/VTM_Series.pdf Lodestone Pacific, 64.51mm diameter vertical toroid mount, 11x19mm, 6 pins, pitch 7.5mm, size 45x11mm^2, drill diamater 1.3mm, pad diameter 3mm, see , script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_MetzConnect THT single screw terminal block Metz Connect Type086_RT03404HBLC pitch 3.81mm length 5.2mm diameter 2.7mm Diode, A-405 series, Axial, Vertical, pin pitch=7.62mm, , length*diameter=16*7.5mm^2, Fastron, XHBCC, http://www.fastrongroup.com/image-show/26/XHBCC.pdf?type=Complete-DataSheet&productType=series Inductor Axial series Axial Vertical pin pitch 5.00mm diameter 19mm supercapacitor Tantalum Capacitor SMD AVX-R (7260-38 Metric), IPC_7351 nominal, (Body size from: http://datasheets.avx.com/schottky.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 5 times 0.5 mm² wires, reinforced insulation, conductor diameter 1.7mm, outer diameter 2mm, outer diameter 2.3mm, size source Multi-Contact FLEXI-xV 2.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_noLead_generator.py TQFN, 28 Pin (http://www.st.com/resource/en/datasheet/stm32f031k6.pdf#page=90), generated with kicad-footprint-generator ipc_noLead_generator.py Texas instruments QFN Package, datasheet: https://www.ti.com/lit/ds/symlink/tpsm53602.pdf Texas Instruments, DSBGA, 1.43x1.41mm, 8 bump 3x3 (perimeter) array, NSMD pad definition (http://www.ti.com/lit/ml/mxbg270/mxbg270.pdf Texas Instruments, DSBGA, 1.36x1.86mm, 12 bump 4x3 grid, NSMD pad definition Appendix A BGA 484 1 FG484 FGG484 Artix-7 BGA, 18x18 grid, 15x15mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=263, NSMD pad definition, 0.8875x1.3875mm, 5 Ball, 2x3 Layout, 0.4mm Pitch, https://www.nxp.com/docs/en/package-information/SOT1963-1.pdf ST LFBGA-354, 16.0x16.0mm, 354 Ball, 19x19 Layout, 0.8mm Pitch, https://www.st.com/resource/en/datasheet/stm32mp151a.pdf ST.

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