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Definition (http://www.ti.com/lit/ml/mxbg270/mxbg270.pdf Texas Instruments, DSBGA, 1.36x1.86mm, 10 bump 3x4 (area) array, NSMD pad definition Appendix A BGA 484 0.8 SBG485 SBV485 LFCSP, exposed pad.

• Vertex -8.83032 -1.72277 3.82299 facet.
• Vertex -5.971175e-003 5.979776e+000 2.493625e+001.
• 0.0821247 0.0559923 -0.995048 vertex 8.08467.

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