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BGA Texas Instruments, DSBGA, 3.0x1.9x0.625mm, 28 ball 7x4 area grid, YZP, YZP0010, 1.86x1.36mm, 10 Ball, 3x4 Layout, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/ts3a24159.pdf Texas Instruments, DSBGA, 0.9x1.4mm, 6 bump 2x3 (perimeter) array, NSMD pad definition Appendix A BGA.

• 4.349585e-001 8.639683e-001 vertex 1.394482e+000 -4.025249e+000.
• 1924541 16A (HC Generic Phoenix Contact.
• -0.31635 -0.826954 vertex 2.05117 2.05117.
• 1836312 8A 320V Generic Phoenix Contact connector footprint.
• -8.0879 5.8736 0.0420134 facet.

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