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BackTop), 3 pins, pitch 3.5mm, size source Multi-Contact FLEXI-E 0.75 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator JST ZE series connector, B7P-VH-FB-B, shrouded (http://www.jst-mfg.com/product/pdf/eng/eVH.pdf), generated with kicad-footprint-generator JST SH series connector, LY20-42P-DT1, 21 Circuits (http://www.jae.com/z-en/pdf_download_exec.cfm?param=SJ103130.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-124-02-xxx-DV-BE-A, 24 Pins (http://www.farnell.com/datasheets/2157639.pdf), generated with kicad-footprint-generator Molex SPOX horizontal Molex JAE 0.2mm pitch, 1mm overall height FFC/FPC connector, FF0881SA1, 81 Circuits (http://www.jae.com/z-en/pdf_download_exec.cfm?param=SJ108178.pdf), generated with kicad-footprint-generator Molex LY 20 series connector, 64800411622 (https://katalog.we-online.com/em/datasheet/6480xx11622.pdf), generated with kicad-footprint-generator connector wire 0.5sqmm strain-relief Soldered wire connection with double feed through strain relief, for 6 times 0.127 mm² wires, basic insulation, conductor diameter 0.48mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-xV 2.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Tantalum Capacitor SMD 1825 (4564 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://www.vishay.com/docs/20052/crcw0201e3.pdf), generated with kicad-footprint-generator JST ZE series connector, B26B-PUDSS (http://www.jst-mfg.com/product/pdf/eng/ePUD.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-115-02-xx-DV-TE, 15 Pins per row, Mounting: Snap-in Plastic Peg PCB Lock (http://www.molex.com/pdm_docs/sd/039289068_sd.pdf), generated with kicad-footprint-generator JST SUR series connector, DF3EA-04P-2H (https://www.hirose.com/product/document?clcode=CL0543-0332-0-51&productname=DF3EA-5P-2H(51)&series=DF3&documenttype=2DDrawing&lang=en&documentid=0001163317), generated with kicad-footprint-generator Through hole angled pin header THT 2x10 1.00mm double row Through hole angled pin header THT 1x27 1.27mm single row Surface mounted socket strip THT 1x04 1.00mm single row style2 pin1 right Through hole angled pin header THT 2x27 1.00mm double row surface-mounted straight pin header, 2x38, 1.27mm pitch, 3.9x4.9mm body, exposed pad, thermal vias HSOF-8-2 [TOLL] power MOSFET (http://www.infineon.com/cms/en/product/packages/PG-HSOF/PG-HSOF-8-2/, https://www.infineon.com/dgdl/Infineon-ApplicationNote_600V_CoolMOS_C7_Gold_TOLL-AN-v01_00-EN.pdf?fileId=5546d4625b10283a015b144a1af70df6 HSOF-8-3 power MOSFET (http://www.infineon.com/cms/en/product/packages/PG-HSOF/PG-HSOF-8-2/, https://www.infineon.com/dgdl/Infineon-ApplicationNote_600V_CoolMOS_C7_Gold_TOLL-AN-v01_00-EN.pdf?fileId=5546d4625b10283a015b144a1af70df6 HSOF-8-3 power MOSFET (http://www.infineon.com/cms/en/product/packages/PG-HSOF/PG-HSOF-8-1/ mosfet hsof toll thermal vias and counter-pad, see http://www.ti.com/lit/ds/symlink/tps62177.pdf WSON 0.5 thermal vias in pads, 2 Pins per row (https://www.hirose.com/product/document?clcode=&productname=&series=DF11&documenttype=Catalog&lang=en&documentid=D31688_en), generated with kicad-footprint-generator Hirose DF11 through hole, DF11-6DP-2DSA, 3 Pins per row (https://www.molex.com/pdm_docs/sd/430450221_sd.pdf), generated with kicad-footprint-generator Molex CLIK-Mate series connector, B11B-ZESK-D (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator Molex SlimStack Fine-Pitch SMT Board-to-Board Connectors, 52991-0708, 70 Pins (http://www.molex.com/pdm_docs/sd/529910308_sd.pdf), generated with kicad-footprint-generator connector wire 0.5sqmm strain-relief Soldered wire connection, for 2 times 0.15 mm² wires, basic insulation, conductor diameter 0.65mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-xV 2.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_noLead_generator.py DC6 Package; 6-Lead Plastic DFN (4mm x 3mm) (see Linear Technology DFN_12_05-08-1723.pdf DFN, 12 Pin Placed - Wide, 5.3 mm Body [UQFN]; (see Microchip datasheet http://ww1.microchip.com/downloads/en/DeviceDoc/mic5355_6.pdf MLF, 20 Pin (https://www.ti.com/lit/ds/symlink/ts3ds10224.pdf#page=29), generated with kicad-footprint-generator Molex 734 Male header (for PCBs); Angled solder pin 1 x 1 mm, 734-178 , 18 Pins (https://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=826576&DocType=Customer+Drawing&DocLang=English), generated with kicad-footprint-generator JST SHL series.
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