3
1
Back

Mm (1050 mils), SMDSocket, LongPads 10-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 32-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils SMD DIP DIL PDIP 2.54mm 10.16mm 400mil Socket LongPads 22-lead though-hole mounted DIP package, row.

New Pull Request