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BackBugfix/v1.1 into main Merge pull request 'Fix rail clearance = ~11.675mm, top and bottom boards. Final work on PCB Added input resistor for sync; placed everything on PCB with exploratory 8hp layout d9153c70802a10d2fe554f80f1a497b409aac630 sr1 77735c00cc3285131373f5cfc61b82eab5963d12 531ebcae92ad8ad00635060e3583259ee13cc12b 77735c00cc3285131373f5cfc61b82eab5963d12 Update README.md 40588ba725f2f6c7240cc5d95c2a8af539e27e15 Update README.md README.md | 5 | 22k | Resistor | | | | | | R30 | 1 | 2_pin_Molex_connector | 2 | 10k | Resistor | | S1 | 1 | TL074 | Quad operational amplifier, DIP-14 A-1135 2 8 pin package (http://datasheet.octopart.com/ZDT6758TA-Zetex-datasheet-68057.pdf Diodes Incorporated PowerDI3333-8, Plastic Dual Flat, No Lead Package (MF) - 6x5 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf QFN Microchip 8E 16 QFN, 44 Pin (http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/QFN_44_05-08-1763.pdf), generated with kicad-footprint-generator Soldered wire connection, for 5 times 0.25 mm² wires, reinforced insulation, conductor diameter 1.4mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-E 2.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times 0.5 mm² wires, reinforced insulation, conductor diameter 1.4mm, see http://www.metz-connect.com/de/system/files/productfiles/Datenblatt_310861_RT034xxHBLC_OFF-026114K.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_WAGO THT Terminal Block WAGO 804-101 45Degree pitch 7.5mm Varistor, diameter 15.5mm, width 6.1mm, pitch 7.5mm Varistor, diameter 15.5mm, width 4.3mm, pitch 5mm size 25x9mm^2 drill 1.3mm pad 2.5mm terminal block RND 205-00287, 2 pins, http://cdn-reichelt.de/documents/datenblatt/A500/DLC2-6GD%28V6%29.pdf LED diameter 20.0mm.
- 6.35mm Pulse A L_Toroid, Vertical.
- Mils), missing pin 7.
- XP_POWER IHxxxxS SIP DCDC-Converter XP_POWER IHxxxxS, SIP, (https://www.xppower.com/pdfs/SF_IH.pdf.