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Body [LFCSP]; (see https://www.intersil.com/content/dam/Intersil/documents/l72_/l72.10x10c.pdf LFCSP VQ, 24 pin, exposed pad, thermal vias, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf 8-pin HTSOP package with missing pin 5, row spacing 10.16 mm (400 mils), LongPads 6-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf.

• Tht Constant current LED Driver DC/DC Converter.
• Bourns 3269W Potentiometer, horizontal.
• 39.8x14mm^2 drill 1.15mm pad.
• -0.459965 -0.538537 0.705981 facet.
• 6.921616e+000 1.747200e+001 facet normal -8.243808e-15 -1.000000e+00 5.722349e-14.

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