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See https://www.mouser.com/ds/2/328/linkswitch-pl_family_datasheet-12517.pdf eSOP-12B SMT Flat Package with Heatsink Tab, https://ac-dc.power.com/sites/default/files/product-docs/topswitch-jx_family_datasheet.pdf Power Integrations eDIP-12B, see https://www.power.com/sites/default/files/product-docs/linkswitch-pl_family_datasheet.pdf 4-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils), LongPads 14-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), SMDSocket, LongPads 64-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), SMDSocket, SmallPads 5-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 10-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils 48-lead surface-mounted (SMD) DIP package, row spacing 5.25 mm (206 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD, JPin SMD 10x-dip-switch SPST KingTek_DSHP10TS, Slide, row spacing 11.48 mm (451 mils 18-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads THT DIP DIL ZIF 10.16mm 400mil SMDSocket SmallPads 4-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf SMD 11x-dip-switch SPST , Slide, row spacing 5.25 mm (206 mils), body size 6.7x26.96mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 9x-dip-switch SPST CTS_Series194-9MSTN, Piano, row spacing 7.62 mm (300 mils), https://toshiba.semicon-storage.com/info/docget.jsp?did=1421&prodName=TLP3021(S Toshiba 11-7A9 package, like 6-lead dip package for Kodenshi SG-105 with PCB locator, 10 Pins (http://www.molex.com/pdm_docs/sd/022272021_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py HTSSOP, 20 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-20/CP_20_8.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 8-Lead Plastic Small Outline (SM) - 5.28 mm Body [UDFN] (see Atmel-8815-SEEPROM-AT24CS01-02-Datasheet.pdf DFN, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/8L_DFN_2x3x0_9_MC_C04-123C.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-0910, with PCB locator, 10 Pins per row (http://www.molex.com/pdm_docs/sd/530470610_sd.pdf), generated with kicad-footprint-generator JST XH vertical boss JST XH series connector, S10B-XH-A-1 (http://www.jst-mfg.com/product/pdf/eng/eXH.pdf.

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