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-5.598804e+000 2.494118e+001 facet normal -0.0348208 0.996914 0.0703598 vertex -8.35846 7.75552 0.18985 facet normal -2.880153e-004 -5.040268e-004 -9.999998e-001 ## Documentation: * [Schematic](Docs/precadsr.pdf) * PCB layout: [front](Docs/precadsr_layout_front.pdf), [back](Docs/precadsr_layout_back.pdf) * [BOM](Docs/precadsr_bom.md) * [Build notes](Docs/build.md ## GitHub repository ## Git repository https://gitlab.com/rsholmes/precadsr Submodules From 83b013c3637bfb179ad62b90a6c8b2f5fb547c8c Mon Sep 17 00:00:00 2001 Subject: [PATCH] SVG decontamination Hardware/Panel/precadsr_panel.svg | 4 | 100k | Resistor | | | Tayda | A-962 | | J10 | 1 | 1 | TL074 | Quad Low-Noise JFET-Input Operational Amplifiers, DIP-14/SOIC-14 | | R14 | 1 create mode 100644 Hardware/Panel/precadsr-panel-Gerbers/precadsr-panel-EdgeCuts.gm1 create mode 100644 Hardware/PCB/precadsr/ao_tht.pretty/Molex_KK-254_AE-6410-02A_1x02_P2.54mm_Vertical.kicad_mod create mode 100644 Panels/Futura XBlk BT.ttf Normal file View File 3D Printing/Pot_Knobs/Pot3.STL Executable file View File Hardware/Panel/precadsr-panel-Gerbers/precadsr-panel-drl_map.pdf Normal file Unescape Envelope/Envelope.kicad_pro Normal file Unescape HP = 5.075; // 5.07 for a single 1 mm² wires, basic insulation, conductor diameter 2.4mm, outer diameter 2.3mm, size source Multi-Contact FLEXI-xV 0.75 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_noLead_generator.py TQFN, 48 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=347), generated with kicad-footprint-generator JST SH series connector, B10B-PHDSS (http://www.jst-mfg.com/product/pdf/eng/ePHD.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py 5-pin TSOT23 package, http://cds.linear.com/docs/en/packaging/SOT_6_05-08-1636.pdf TSOT-23-6 MK06A TSOT-6 Hand-soldering TSOT, 8 Pin (http://www.ti.com/lit/ml/mpds382b/mpds382b.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py DD Package; 8-Lead Plastic VSON, 3x3mm Body, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32g473pb.pdf ST UFBGA-129, 7.0x7.0mm, 129 Ball, 13x13 Layout, 0.5mm Pitch, DSC0010J, WSON, http://www.ti.com/lit/ds/symlink/tps61201.pdf Plastic Small Outline (SS)-5.30 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf, http://www.onsemi.com/pub/Collateral/NCP1207B.PDF 8-Lead Plastic Dual Flat, No Lead Package - 3x3 mm Body [SOIC], see https://ac-dc.power.com/sites/default/files/product-docs/senzero_family_datasheet.pdf Power-Integrations variant of MSOP-16 (see http://cds.linear.com/docs/en/datasheet/3630fd.pdf 12-Lead Plastic DFN (2mm x 2mm) (see Linear Technology DFN_16_05-08-1706.pdf DHD Package; 18-Lead Plastic DFN (2mm x 2mm), http://ams.com/eng/content/download/950231/2267959/483138 DD Package; 8-Lead Plastic Dual Flat, No Lead Package - 4.0x4.0x0.8 mm Body [TSSOP] with exposed pad (http://www.onsemi.com/pub/Collateral/NCP4308-D.PDF WDFN, 12 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/3652fe.pdf#page=24), generated with kicad-footprint-generator ipc_noLead_generator.py DD Package; 14-Lead Plastic DFN, 4mm x 3mm MLF - 3x3x0.85 mm Body (http://ww1.microchip.com/downloads/en/DeviceDoc/20005010F.pdf 8-Lead.

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