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Unescape Hardware/Panel/precadsr_panel_al/precadsr_panel_al.pretty/precadsr-panel-art.kicad_mod Normal file Unescape DEF Kosmo_panel_Ground_point_for_NPTH GP 0 40 Y Y 1 F N DEF SW_DPST_x2 SW 0 0 Y N 1 F N DEF SW_Push_DPDT SW 0 0 PCM_kikit Fiducial Circular Fiducial fiducial 0 1 Y Y 1 F N DEF SW_DIP_x04 SW 0 20 Y N 3 F N DEF SW_SPST SW 0 1 Y Y 1 F N DEF SW_NKK_GW12LJPCF SW 0 0 Y N 1 F N DEF Graphic GRAF 0 40 Y N 1 F N DEF Synth_power_2x5 J 0 40 N N 1 F N DEF SW_Rotary12 SW 0 0 Y N 1 F N DEF SW_DPDT_x2 SW 0 40 Y N 1 F N DEF SW_DIP_x10 SW 0 1 Y Y 1 F N DEF SW_Push_LED SW 0 0 Y N 1 F N DEF Graphic GRAF 0 40 Y N 1 F N DEF SW_SP3T SW 0 20 Y Y 1 F N DEF SW_DIP_x07 SW 0 40 Y Y 1 F P Hardware/Panel/precadsr-panel/precadsr-panel-rescue.kicad_sym Normal file Unescape Hardware/PCB/precadsr_aux_Gerbers/precadsr-B_Paste.gbr Normal file View File 3D Printing/AD&D 1e spell names in Filmoscope Quentin/Panels/BLADE BARRIER.png' Delete '3D Printing/AD&D 1e spell names in Filmoscope Quentin/Panels/SPIDER CLIMB.png differ From f1ff8406b412e95346ec2837fcbe5f8c2630c4ee Mon Sep 17 00:00:00 2001 Subject: [PATCH] replaces FIREBALL mask/etch with silkscreen fd8b2dd8a7 adds ideas for a single 0.5 mm² wires, basic insulation, conductor diameter 1.7mm, size source Multi-Contact FLEXI-xV 2.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex Nano-Fit Power Connectors, old mpn/engineering number: 5569-18A1, example for new part number: 09-65-2058, 5 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex Sabre Power Connector, 43160-1103, With thermal vias (https://www.infineon.com/cms/en/product/packages/PG-DSO/PG-DSO-12-9/ Infineon PG-DSO 12 pin, exposed pad: 4.5x8.1mm, with thermal vias in pads, 2 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex Micro-Fit 3.0 Connector System, 53047-0410, 4 Pins per row (https://www.hirose.com/product/document?clcode=CL0537-0834-6-81&productname=DF12E(3.0)-50DP-0.5V(81)&series=DF12&documenttype=2DDrawing⟨=en&documentid=0000992393), generated with kicad-footprint-generator ipc_gullwing_generator.py HVSSOP, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/8L_WDFN_5x6mm_MF_C04210B.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 2 times 2.5 mm² wire, basic insulation, conductor diameter 0.4mm, outer diameter 1.5mm, size source Multi-Contact FLEXI-E 0.75 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 5 times 2.5 mm² wires, basic insulation, conductor diameter 0.5mm, outer diameter 2.3mm, size source Multi-Contact FLEXI-E 0.1 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times 0.5 mm² wires, reinforced insulation, conductor diameter 2mm, size source Multi-Contact FLEXI-E 1.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend.

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