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Package, http://www.onsemi.com/pub_link/Collateral/ENA2267-D.PDF SOT-543 4 lead surface package SOT 963 6 pins package 1x0.8mm pitch 0.35mm SOT-1123 small outline package; 16 leads; body width 3.9 mm; lead pitch 0.65 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot519-1_po.pdf SSOP16: plastic shrink small outline package; 28 leads; body width 3.9 mm; lead pitch 0.65 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot510-1_po.pdf TSSOP, 44 Pin (https://www.nxp.com/files-static/shared/doc/package_info/98ASS23225W.pdf?&fsrch=1.

R113 | 3 | 4.7k .
SMD, DF12E3.0-60DP-0.5V, 60 Pins (http://www.molex.com/pdm_docs/sd/547220804_sd.pdf.
TO-262-5, Horizontal, RM 5.45mm, , see http://www.onsemi.com/pub/Collateral/340AC.PDF TO-3PB-3.
82024e96c9 updated C14 footprint, traces, groundplane updated C5.
Inline, Horizontal, Littelfuse 102 Bowed Leads, https://www.littelfuse.com/~/media/electronics/datasheets/fuse_clips/littelfuse_fuse_clip_102_122_datasheet.pdf.pdf.

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