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DF13-05P-1.25DS, 5 Pins per row (http://www.molex.com/pdm_docs/sd/1053131208_sd.pdf), generated with kicad-footprint-generator Molex KK-254 Interconnect System, old/engineering part number: 26-60-4080, 8 Pins per row (http://www.molex.com/pdm_docs/sd/530470610_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py LQFP, 80 Pin (JEDEC MO-153 Var DB-1 https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator Molex KK-254 Interconnect System, old/engineering part number: A-41791-0008 example for new part number: A-41792-0015 example for new part number: A-41792-0003 example for new mpn: 39-28-906x, 3 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Soldered wire connection, for 6 times 0.1 mm² wires, reinforced insulation, conductor diameter 2.4mm, outer diameter 2.3mm, size source.

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