3
1
Back

Connector x1 http://www.ritrontek.com/uploadfile/2016/1026/20161026105231124.pdf#page=70 Highspeed card edge connector for 2.4mm PCB's with 20 contacts (not polarized Highspeed card edge card connector socket for 2.36mm PCBs, vertical, alignment pins, weld tabs (source: https://suddendocs.samtec.com/prints/hsec8-1xxx-xx-xx-dv-x-xx-footprint.pdf 0.8 mm BGA-64, 10x10 raster, 10x10mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=267, NSMD pad definition Appendix A BGA 676 1 FB676 FBG676 FBV676 Kintex-7 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=298, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=94, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double rows Through hole angled socket strip, 2x30, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole straight pin header, 2x14, 2.00mm pitch, single row Surface mounted pin header SMD 1x07 2.00mm single row Through hole angled socket strip SMD 1x15 2.54mm single row (from Kicad 4.0.7), script generated Through hole angled socket strip SMD 1x32 2.00mm single row style1 pin1 left Surface mounted pin header THT 2x13 2.54mm double row Through hole pin header SMD 2x25 2.54mm double row surface-mounted straight pin header, 2x31, 2.00mm pitch, 6.35mm socket length, single row Surface mounted socket strip SMD 2x02 1.27mm double row SMD IDC box header THT 2x12 2.00mm double row Through hole angled pin header, 2x08, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows Through hole straight Samtec HPM power header series.

New Pull Request