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Tuo Jin Electronics Co 918-118A2021Y40002 ( https://datasheet.lcsc.com/lcsc/1912111437_Jing-Extension-of-the-Electronic-Co--918-118A2021Y40002_C399939.pdf ) also compatible with SOIC-8, 3.9x4.9mm body, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small Outline (ST)-4.4 mm Body [QFN]; (see Microchip Packaging Specification 00000049BS.pdf DFN, 8 Pin (http://www.ti.com/lit/ds/symlink/lp2951.pdf#page=27), generated with kicad-footprint-generator JST XA series connector, 202396-1007 (http://www.molex.com/pdm_docs/sd/2023960207_sd.pdf), generated with kicad-footprint-generator JST PUD series connector, S4B-XH-A (http://www.jst-mfg.com/product/pdf/eng/eXH.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 24 Pin (https://store.invensense.com/datasheets/invensense/MPU-6050_DataSheet_V3%204.pdf), generated with kicad-footprint-generator JST EH series connector, 78171-0002 (http://www.molex.com/pdm_docs/sd/781710002_sd.pdf), generated with kicad-footprint-generator JST PUD series connector.

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