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6x5, 0.5P; CASE 505AB (see ON Semiconductor 506CN.PDF DC8 Package 8-Lead Plastic SO, Exposed Die Pad (see Microchip Packaging Specification 00000049BS.pdf DCB Package 8-Lead Plastic DFN (2mm x 2mm) 0.40mm pitch DDB Package; 10-Lead Plastic DFN (5mm x 4mm) (see Linear.

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