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Phoenix PTSM-0,5-2-2.5-H-THR, 2 pins, Rectangular size 4.5x1.6mm^2, 2 pins, diameter 5.0mm z-position of LED center 1.6mm 2 pins LED_Rectangular, Rectangular, Rectangular size 5.0x2.0mm^2 z-position of LED center 1.0mm, 2 pins, http://www.kingbright.com/attachments/file/psearch/000/00/00/L-5603QBC-D(Ver.12B).pdf LED_Oval Oval Oval size 5.2x3.8mm^2, 2 pins, pitch 5mm, size 45x9.8mm^2, drill diamater 1.1mm, pad diameter 2.2mm, see http://www.mouser.com/ds/2/324/ItemDetail_1725656-920552.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_Phoenix THT Terminal Block 4Ucon ItemNo. 10690, 13 pins, pitch 10mm, size 35x10.3mm^2, drill diamater 1.4mm, pad diameter 2.6mm, see http://www.farnell.com/datasheets/100425.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_RND THT terminal block Metz Connect Type059_RT06304HBWC, 4 pins, pitch 2.54mm, size 28.4x6.5mm^2, drill diamater 1.1mm, pad diameter 2.5mm, see http://cdn-reichelt.de/documents/datenblatt/C151/RND_205-00001_DB_EN.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_WAGO THT Terminal Block WAGO 236-203 45Degree pitch 7.5mm Varistor, diameter 12mm, width 4.6mm, pitch 10mm Mallory low-profile piezo buzzer, https://mspindy.com/spec-sheets/AST1109MLTRQ.pdf 5.5V, 470mF supercapacitor, 45mohm, -40ºC to +70ºC, https://www.cap-xx.com/wp-content/uploads/datasheets/CAP-XX-DMF470mF-Datasheet.pdf Cliff single 4mm shrouded banana panel socket, through-hole, row spacing 8.61 mm (338 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD, JPin SMD DIP Switch SPST Slide 8.61mm 338mil SMD SMD 5x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 11x-dip-switch SPST , Piano, row spacing 8.89 mm (350 mils), SMDSocket, SmallPads THT DIP DIL PDIP 2.54mm 7.62mm 300mil PowerIntegrations variant of 8-Lead Plastic PSOP, Exposed Die Pad (see Microchip Packaging Specification 00000049BS.pdf, http://www.onsemi.com/pub/Collateral/NCP1207B.PDF 8-Lead Plastic Dual Flat, No Lead Package - 4.0x4.0x0.8 mm Body [UQFN]; (see Microchip Packaging Specification 00000049BS.pdf DFN, 10 Pin (https://www.onsemi.com/pdf/datasheet/nis5420-d.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55935-0430, 4 Pins per row (http://www.molex.com/pdm_docs/sd/428192214_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP, 36 Pin (JEDEC MO-153 Var BB https://www.jedec.org/document_search?search_api_views_fulltext=MO-194), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: 26-60-5180, 18 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex SlimStack Fine-Pitch SMT Board-to-Board Connectors, 54722-0804, 80 Pins (https://www.molex.com/pdm_docs/sd/537480308_sd.pdf), generated with kicad-footprint-generator.

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