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During soldering - ground planes connect to holes - these gaps reduce heat conduction during soldering - ground plane 5e32fb4fc0953f2a10f8dc9cf7a0a3653bcbf4f2 @circuitlocution.com created pull request synth_mages/MK_VCO#3 created pull request synth_mages/MK_VCO#5

everything done as a kind of pitch and gate CV between 1 and 2 above.

• -0.0922853 0.994036 vertex -7.35197.
• Pitch, https://www.st.com/resource/en/datasheet/stm32h7a3ai.pdf ST WLCSP-156, ST die ID 483.

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