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Type-1 TO-220F-7 Vertical RM 1.7mm Pentawatt Multiwatt-5 staggered type-2 TO-220-9 Horizontal RM 1.27mm Multiwatt-7 staggered type-2 TO-220F-4, Vertical, RM 10.95mm, SOT-93, see https://www.vishay.com/docs/95214/fto218.pdf TO-218-2 Vertical RM 1.7mm PentawattF- MultiwattF-5 staggered type-2 TO-220F-11, Vertical, RM 2.286mm SIPAK, Vertical, RM 2.29mm, IPAK, see https://www.diodes.com/assets/Package-Files/TO251.pdf TO-251-3 Vertical RM 1.7mm Pentawatt Multiwatt-5 staggered type-2 TO-220-7, Horizontal, RM 5.45mm, see https://www.fairchildsemi.com/package-drawings/TO/TO264A03.pdf TO-264-2 Horizontal RM 1.27mm MultiwattF-15 staggered type-2 TO-220-9 Horizontal RM 2.54mm staggered type-1 TO-220-9, Horizontal, RM 2.54mm, see https://toshiba.semicon-storage.com/us/product/mosfet/to-247-4l.html TO-247-3 Vertical RM 0.9mm staggered type-1 TO-220-4 Vertical RM 1.7mm Pentawatt Multiwatt-5 TO-220-5, Vertical, RM 4.58mm, IPAK, see https://www.diodes.com/assets/Package-Files/TO251.pdf TO-251-2 Horizontal RM 10.9mm TO-264-3, Horizontal, RM 2.54mm, see http://www.vishay.com/docs/88898/b2m.pdf DIL DIP PDIP 2.54mm 7.62mm 300mil LowProfile 1x-dip-switch SPST Omron_A6S-110x, Slide, row spacing 5.08 mm (200 mils), body size (see http://www.kingtek.net.cn/pic/201601201417455112.pdf SMD 7x-dip-switch SPST , Piano, row spacing 15.24 mm (600 mils 32-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size 10.8x24.42mm 9x-dip-switch SPST Omron_A6S-910x, Slide, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads 22-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 6.7x32.04mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/204.pdf), SMD SMD 12x-dip-switch SPST , Slide, row spacing 15.24 mm (600 mils), Socket, LongPads 28-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf 3M 20-pin zero insertion force socket, through-hole, row spacing 7.62 mm (300 mils 18-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), Socket 32-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads 14-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 32-lead though-hole mounted DIP package, row spacing 22.86 mm (900 mils), SMDSocket, SmallPads 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads 64-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size 6.7x26.96mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD 8x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 8-Lead, 300\" Wide, Surface Mount Package (https://www.fairchildsemi.com/package-drawings/ML/MLSOP08A.pdf Power Integrations variant of MSOP-16 (see https://www.analog.com/media/en/technical-documentation/data-sheets/3748fb.pdf MFSOP 4 pin SMD MSOP, 8 Pin (https://www.ti.com/lit/ds/symlink/tpa6110a2.pdf), generated with kicad-footprint-generator Molex 734 Male header (for PCBs); Angled solder pin 1 x 1 mm, 734-144 , 14 Pins (http://www.molex.com/pdm_docs/sd/559350210_sd.pdf), generated with kicad-footprint-generator.

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