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Bulk Pack, 1.27mm Pitch (http://www.allegromicro.com/~/media/Files/Datasheets/A1369-Datasheet.ashx Allegro Microsystems SIP-3, 1.27mm Pitch (http://www.allegromicro.com/~/media/Files/Datasheets/A1363-Datasheet.ashx Diodes SIP-3 Bulk Pack Diodes SIP-3 Bulk Pack, 1.27mm Pitch (https://www.diodes.com/assets/Package-Files/SIP-3-Bulk-Pack.pdf Diodes SIP-3 Bulk Pack, 1.27mm Pitch (http://www.allegromicro.com/~/media/Files/Datasheets/A1369-Datasheet.ashx Allegro Microsystems 12-Lead (10-Lead Populated) Quad Flat No-Lead Package, 3x3mm Body (see Microchip Packaging Specification 00000049BS.pdf 8-Lead Plastic Dual Flat, No Lead Package (MF) - 3x3x0.9 mm Body [SOIC], see https://ac-dc.power.com/sites/default/files/product-docs/senzero_family_datasheet.pdf Power-Integrations variant of 8-lead though-hole mounted DIP package, row spacing 6.73 mm (264 mils), body size (see http://www.kingtek.net.cn/pic/201601201417455112.pdf SMD 10x-dip-switch SPST Omron_A6S-1010x, Slide, row spacing 16.51 mm (650 mils), SMDSocket, SmallPads THT DIP DIL PDIP 2.54mm 10.16mm 400mil SMDSocket SmallPads 22-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf THT DIP DIL PDIP SMDIP 2.54mm 11.48mm 451mil 6-lead surface-mounted (SMD) DIP package, row spacing 25.4 mm (1000 mils 64-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf 3M 18-pin zero insertion force socket, through-hole, row spacing 6.73 mm (264 mils), body size (see http://www.kingtek.net.cn/pic/201601201417455112.pdf SMD DIP DIL PDIP 2.54mm 22.86mm 900mil Socket LongPads 64-lead though-hole mounted DIP package, row spacing 11.43 mm (450 mils), SMDSocket, SmallPads 8-lead though-hole mounted DIP package, row.

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