3
1
Back

Strip, HLE-123-02-xx-DV-PE-LC, 23 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole 2.7mm, height 5, Wuerth electronics 9774020951 (https://katalog.we-online.de/em/datasheet/9774020951.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole ST Morpho Connector 144 STLink AI accelerated MCU with optional wifi, https://dl.sipeed.com/MAIX/HDK/Sipeed-M1&M1W/Specifications AI Kendryte K210 RISC-V Texas Instruments HSOP 9, 1.27mm pitch, double rows Through hole socket strip THT 1x04 1.00mm single row Through hole socket strip SMD 1x40 2.00mm single row Surface mounted socket strip SMD 2x39 2.54mm double row surface-mounted straight socket strip, 2x09, 1.27mm pitch, double rows Through hole socket strip SMD 1x33 1.27mm single row (from Kicad 4.0.7), script generated Through hole pin header SMD 1x19 1.00mm single row Through hole IDC header, 2x30, 2.54mm pitch, 8.51mm socket length, double rows.

New Pull Request