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133-pin BGA uModule, 15.0x15.0x4.92mm, https://www.analog.com/media/en/technical-documentation/data-sheets/4637fc.pdf MAPBGA 9x9x1.11 PKG, 9.0x9.0mm, 272 Ball, 17x17 Layout, 0.8mm Pitch, https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=24 FBGA-78, 10.5x8.0mm, 78 Ball, 9x13 Layout, 0.8mm Pitch, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-bga/05081600_0_bga49.pdf https://www.analog.com/media/en/technical-documentation/product-information/assembly-considerations-for-umodule-bga-lga-package.pdf BGA 324 0.8 CS325 CSG235 Spartan-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=299, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0102.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole straight socket strip, 1x18, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled socket strip THT 1x35 2.00mm single row (https://gct.co/files/drawings/bc065.pdf), script generated Through hole pin header THT 2x35 2.00mm double row surface-mounted straight socket strip, 2x38, 2.54mm pitch, 6mm pin length, single row Surface mounted pin header SMD 1x23 1.27mm single row (from Kicad 4.0.7), script generated Through hole socket strip THT 1x19 1.00mm single row style2 pin1 right Through hole angled pin header, 2x11, 1.00mm pitch, double rows Through hole straight pin header, 1x05, 2.54mm pitch, double rows Through hole Samtec HPM power header series 3.81mm post length, 1x09, 5.08mm pitch, single row Surface mounted socket strip SMD 1x25 2.54mm single row style2 pin1 right Through hole IDC header, 2x10, 2.54mm pitch, 8.51mm socket length, single row Through hole IDC header, 2x20, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 6.5mm latches, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole angled pin header, 2x22, 1.27mm pitch, double rows latches, mounting holes, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole IDC header, 2x07, 2.54mm pitch, double rows Surface mounted pin header SMD 2x11 2.00mm double row Through hole pin header THT 2x28 1.27mm double row surface-mounted straight pin header, 1x17, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 9.5mm latches, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole pin header THT 1x31 2.54mm single row style1 pin1 left Surface mounted socket strip SMD Solder 3-pad Jumper, 1x1.5mm Pads, 0.3mm gap, pads 1-2 Bridged2Bar with 2 copper strip, labeled with numbers SMD Solder Jumper, 1x1.5mm, rounded Pads, 0.3mm gap, open, labeled with numbers SMD Solder 3-pad Jumper, 1x1.5mm rounded Pads, 0.3mm gap, pads 1-2 Bridged2Bar with 2 From 9e7b04561b8893062b3378503805ddd100c7260f Mon Sep 17 00:00:00 2001 .../Panels/SPIDER CLIMB.png | Bin 0 -> 146728 bytes Images/IMG_6771.JPG | Bin 11675 -> 0 bytes From d40f7ca1ca9e3e0f97e1dc4f553b9c659940a311 Mon Sep 17 00:00:00 2001 Subject: [PATCH 08/18] couple more GND-stitch vias Undo converting GND to GND_JMP and fix everything that broke created pull request 'pcb_finalization' (#1) from pcb_finalization into main Merge pull request 'Fix rail clearance issues, make all.

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