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9 Ball, 3x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g071eb.pdf ST WLCSP-36, ST die ID 456, 1.94x2.4mm, 20 Ball, 4x5 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100489.PDF WLCSP-25, 5x5 raster, 2.097x2.493mm package, pitch 0.4mm; see section 10.3 of https://www.parallax.com/sites/default/files/downloads/P8X32A-Propeller-Datasheet-v1.4.0_0.pdf 44-Lead Plastic Thin Quad Flatpack (PF) - 14x14x1 mm Body, 2.00 mm [TQFP] (see Microchip Packaging Specification 00000049BS.pdf 80-Lead Plastic Thin Quad Flatpack (PF) - 14x14x1 mm Body, 2.00 mm [TQFP] (see Microchip Packaging Specification 00000049BS.pdf 48-Lead Thin Quad Flatpack (PT) - 10x10x1.0 mm Body [SSOP] (see Microchip Packaging Specification 00000049BS.pdf 20-Lead Plastic Thin Quad Flatpack (MW) - 10x10x1.0 mm Body [SOIC], pin 7 8-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), Socket THT DIP DIL PDIP SMDIP 2.54mm 9.53mm 375mil 4-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), LongPads 22-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), LongPads 18-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), SMDSocket, SmallPads 28-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), see https://www.vishay.com/docs/91361/hexdip.pdf THT DIP DIL PDIP 2.54mm 7.62mm 300mil 2x-dip-switch SPST Omron_A6H-2101, Slide, row spacing 7.62 mm (300 mils), body size 6.7x9.18mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf 12x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), see http://cdn-reichelt.de/documents/datenblatt/A400/HDBL101G_20SERIES-TSC.pdf DIL DIP PDIP 5.08mm 2.54 4-lead dip package with 1.27mm pin pitch, compatible with Korean HRO Parts Elec TYPE-C-31-G-06 USB Type-C receptacle for USB 2.0 Type C Plug Shenzhen Jing Tuo Jin Electronics Co 918-118A2021Y40002 ( https://datasheet.lcsc.com/lcsc/1912111437_Jing-Extension-of-the-Electronic-Co--918-118A2021Y40002_C399939.pdf ) also compatible with SOIC-8, 3.9x4.9mm² body, exposed pad, 4x4mm body, pitch 0.5mm, thermal vias with large copper area, as proposed in http://www.ti.com/lit/ds/symlink/tps5430.pdf TSOP-I, 24 Pin (https://www.jedec.org/standards-documents/docs/mo-142-d variation DB), generated with kicad-footprint-generator ipc_gullwing_generator.py HTSSOP, 24 Pin (http://www.ti.com/lit/ds/symlink/ts3a27518e.pdf#page=33), generated with kicad-footprint-generator Molex Molex 1.00mm Pitch Easy-On BackFlip, Right-Angle, Bottom Contact FFC/FPC, 200528-0060, 6 Circuits (https://www.molex.com/pdm_docs/sd/2005280060_sd.pdf), generated with kicad-footprint-generator JST EH side entry Molex Micro-Fit 3.0 Connector System, 5268-04A, 4 Pins per row (https://www.hirose.com/product/en/products/DF63/), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 6 times 2 mm² wires, basic insulation, conductor diameter 0.9mm, outer diameter 2.3mm, size source Multi-Contact FLEXI-xV 1.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-111-02-xxx-DV-A, 11 Pins (http://www.molex.com/pdm_docs/sd/559320210_sd.pdf), generated with kicad-footprint-generator Samtec HLE .100.

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