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Body [HTSSOP], with thermal vias; see section 48.2.4 of http://ww1.microchip.com/downloads/en/DeviceDoc/DS60001479B.pdf WLCSP-81, 9x9, 0.4mm Pitch, YFF0006, NSMD pad definition (http://www.ti.com/lit/ds/symlink/tlv320aic23b.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf Texas Instruments, DSBGA, 1.43x1.41mm, 8 bump 3x3 array, NSMD pad definition Appendix A Spartan-7 BGA, 14x14 grid, 15x15mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=278, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=92, NSMD pad definition Appendix A BGA 238 0.5 CPG238 Spartan-7 BGA, 14x14 grid, 15x15mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=79, NSMD pad definition (http://www.ti.com/lit/ml/mxbg270/mxbg270.pdf Texas Instruments, DSBGA, 3.415x3.535x0.625mm, 64 ball 8x8 area grid, NSMD, YZP0005 pad definition, 1.468x0.705mm, 8 Ball, 2x4 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g071eb.pdf ST WLCSP-36, ST die ID 468, 3.15x3.13mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g483me.pdf ST WLCSP-81, ST die ID 483, 3.73x4.15mm, 115 Ball, Y-staggered 11x21 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h747xi.pdf DFN, 6 Pin (https://www.nxp.com/docs/en/package-information/SOT457.pdf), generated with kicad-footprint-generator JST XA series connector, B10B-ZESK-1D, with boss (http://www.jst-mfg.com/product/pdf/eng/eXH.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py Infineon PG-DSO 12 pin, exposed pad, thermal vias, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf 8-pin HTSOP package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm body, exposed pad, thermal vias in pads, 3 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for a box film cap for 100v is smaller, but not to front panel design and includes 2.5mm centerward shift for input and output jacks triangle_out = [output_column, row_2, 0]; cv_2b_atten = [right_col, row_7, 0]; manual_1 = [left_col, row_3, 0]; manual_2 = [left_col, row_7, 0]; cv_in_1b = [right_col, row_6, 0]; cv_1b_atten = [right_col, row_2, 0]; fm_in = [h_margin+working_width/8, row_2, 0]; fm_lvl = [h_margin+working_width/8, row_3, 0]; left_rib_x = hole_dist_side + thickness; v_margin = hole_dist_top*5; output_column = width_mm - thickness*2; // How much horizontal space needed for left-hand and right-hand sub-panels right_panel_width = width_mm - thickness*2; union() { difference() { union() { shape(fsh, cird+cdp*smt/100, cord, cfn*4, chg); module shape(hsh, ird, ord, fn4, hg) { x0= 0; x1 = hsh > 0 ? Ord : ird; y0=-0.1; y1=0; y2=abs(hsh); y3=hg-abs(hsh); y4=hg; y5=hg+0.1; if ( hsh >= 0 module knurled_finish(ord, ird, lf, sh, fn, rn) { for(j=[0:rn-1]) assign(h0=sh*j, h1=sh*(j+1/2), h2=sh*(j+1)) { for(i=[0:fn-1]) assign(lf0=lf*i, lf1=lf*(i+1/2), lf2=lf*(i+1)) { polyhedron( points=[ [ 0,0,h0], [ ord*cos(lf0), ord*sin(lf0), h0], [ ird*cos(lf0), ird*sin(lf0), h1], [ 0,0,h2], [ ord*cos(lf0), ord*sin(lf0), h0], [ ird*cos(lf1), ird*sin(lf1), h2], [ ird*cos(lf1), ird*sin(lf1), h2], [ ird*cos(lf1), ird*sin(lf1), h2], [ ird*cos(lf1), ird*sin(lf1), h2], [ ird*cos(lf1), ird*sin(lf1), h2], [ ord*cos(lf2), ord*sin(lf2), h0], [ ird*cos(lf0), ird*sin(lf0), h1], [ ord*cos(lf0), ord*sin(lf0), h0], [ ord*cos(lf2), ord*sin(lf2), h2] echo(" Knurled Surface Library v2.

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