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1turn HDM0131A Neosid, Air-Coil, SML, 2turn, HAM0331A, Neosid Air-Coil SML 6turn HAM0631A Neosid, Micro Coil, Inductor, Ms36-L, SMD, Fixed inductor, SMD, magneticaly shielded, https://neosid.de/import-data/product-pdf/neoFestind_Ms42.pdf Neosid Inductor SMs95 Fixed inductor SMD Neosid, Power Inductor, SMS-ME3015, Fixed inductor, SMD, https://neosid.de/import-data/product-pdf/neoFestind_Ms85.pdf Neosid Ms85 Ms85T SMD Inductor Coilcraft LPS4018 https://www.coilcraft.com/pdfs/lps4018.pdf Shielded Power Inductor WE-PD 7345 Wuerth Shielded Power Inductor WE-PD TypLS Wuerth Shielded Power Inductor (http://products.sumida.com/products/pdf/CDMC6D28.pdf Inductor Sumida SMD CDMC6D28 Inductor, Sumida, 8.1mm × 7.3mm × 5.5 mm, Unshielded, http://products.sumida.com/products/pdf/CR75.pdf Inductor SMD 01005 (0402 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator Molex CLIK-Mate series connector, SM05B-XAGKS-BN-TB (http://www.jst-mfg.com/product/pdf/eng/eXAG.pdf), generated with kicad-footprint-generator Molex Nano-Fit Power Connectors, old mpn/engineering number: 5569-24A2, example for new mpn: 39-28-x04x, 2 Pins per row (http://www.molex.com/pdm_docs/sd/530470610_sd.pdf), generated with kicad-footprint-generator JST SUR series connector, 502386-1370 (http://www.molex.com/pdm_docs/sd/5023860270_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py Nexperia wafer level chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l562ce.pdf ST WLCSP-90, ST die ID 471, 4.437x4.456mm, 100 Ball, 10x10 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g431c6.pdf ST WLCSP-49, off-center ball grid, ST die ID 450, 4.96x4.64mm, 156 Ball, 13x12 Layout, 0.35mm Pitch, https://www.onsemi.com/pdf/datasheet/ncp163-d.pdf#page=23 6pin Pitch 0.4mm WLCSP WLCSP/XFBGA 8-pin package, staggered pins, http://www.adestotech.com/wp-content/uploads/DS-AT25DF041B_040.pdf WLCSP WLCSP-8 XFBGA XFBGA-8 CSP BGA Chip-Scale Glass-Top WLCSP-8, 2.284x1.551mm, 8 Ball, 2x4 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l412t8.pdf ST WLCSP-49, off-center ball grid, ST die ID 480, 4.57x4.37mm, 132 Ball, 12x11 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h725vg.pdf ST WLCSP-115, ST die ID 495, 4.4x4.38mm, 100 Ball, 10x10 Layout, 0.4mm Pitch, http://www.st.com/content/ccc/resource/technical/document/technical_note/92/30/3c/a1/4c/bb/43/6f/DM00103228.pdf/files/DM00103228.pdf/jcr:content/translations/en.DM00103228.pdf pSemi CSP-16 1.64x2.04x0.285mm (http://www.psemi.com/pdf/datasheets/pe29101ds.pdf, http://www.psemi.com/pdf/app_notes/an77.pdf UFD Package, 4-Lead Plastic Small Outline (SO) (http://www.everlight.com/file/ProductFile/201407061745083848.pdf 5-Lead Plastic Small outline http://www.ti.com/lit/ml/mpds158c/mpds158c.pdf VSO40: plastic very small outline 7,5mm long https://toshiba.semicon-storage.com/info/docget.jsp?did=53548&prodName=TLP2770 6-Lead Plastic DFN (2mm x 3mm) (see Linear Technology DFN_16_05-08-1732.pdf.

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