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/ QFP256J CASE 122BX (see ON Semiconductor 506AF.PDF DKD Package; 24-Lead Plastic Shrink Small Outline Package (MS) [MSOP], variant of 8-Lead Plastic DFN (4mm x 4mm); Pitch 0.5mm; EP 2.7x2.6mm; for InvenSense motion sensors; Mask removed below exposed pad; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU-6050_DataSheet_V3%204.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic QFN (4mm x 4mm); Pitch 0.5mm; EP 2.7x2.6mm; for InvenSense motion sensors; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU9250REV1.0.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic DFN (4mm x 3mm) (see Linear Technology DFN_12_05-08-1723.pdf DFN, 12 Pin (http://www.ti.com/lit/ds/symlink/ldc1312.pdf#page=62), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 16 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp_16_17.pdf), generated with kicad-footprint-generator Connector Phoenix Contact connector footprint for: MCV_1,5/3-G-3.5; number of pins: 06; pin pitch: 3.81mm; Angled; threaded flange || order number: 1766864 12A 630V Generic Phoenix Contact connector footprint for: MCV_1,5/14-GF-3.81; number of pins: 11; pin pitch: 5.00mm; Angled; threaded flange; footprint includes mount hole for mounting screw: ISO 1481-ST 2.2x6.5 C.

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