Labels Milestones
Back[QSOP] (see Microchip Packaging Specification 00000049BS.pdf 44-Lead Plastic Shrink Small Outline (SO), see https://docs.broadcom.com/cs/Satellite?blobcol=urldata&blobheader=application%2Fpdf&blobheadername1=Content-Disposition&blobheadername2=Content-Type&blobheadername3=MDT-Type&blobheadervalue1=attachment%3Bfilename%3DIPD-Selection-Guide_AV00-0254EN_030617.pdf&blobheadervalue2=application%2Fx-download&blobheadervalue3=abinary%253B%2Bcharset%253DUTF-8&blobkey=id&blobnocache=true&blobtable=MungoBlobs&blobwhere=1430884105675&ssbinary=true 6-pin plasic small outline package; 44 leads; body width 4.4 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot371-1_po.pdf STC SOP, 16 Pin (https://www.haloelectronics.com/pdf/discrete-ultra-100baset.pdf), generated with kicad-footprint-generator.
- 0.0922671 0.172963 0.980597 vertex 5.0946 5.35022 6.88312 facet.
- Vertex -5.28808 -8.58625 2.58057 facet normal 8.566012e-01.
- MCV_1,5/7-GF-3.5; number of pins: 03; pin pitch.
- Variant of 8-lead though-hole mounted DIP package, row.
- Normal 5.735729e-001 2.554278e-003 8.191506e-001.