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Size 6.7x26.96mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 7x-dip-switch SPST , Slide, row spacing 9.53 mm (375 mils), Clearance8mm 18-lead surface-mounted (SMD) DIP package, row spacing 11.48 mm (451 mils 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 64-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 5x-dip-switch SPST , Slide, row spacing 15.24 mm (600 mils), Socket, LongPads THT DIP DIL ZIF 25.4mm 1000mil 40-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), SMDSocket, SmallPads THT DIP DIL PDIP 2.54mm 10.16mm 400mil 4-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size 9.78x32.66mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 5x-dip-switch SPST , Slide, row spacing 11.48 mm (451 mils 22-lead surface-mounted (SMD) DIP package, row spacing 5.25 mm (206 mils), body size 9.78x25.04mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf 6x-dip-switch SPST , Piano, row spacing 7.62 mm (300 mils), Socket, LongPads 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 24-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size 10.8x4.1mm DIP Switch SPST Slide 6.15mm 242mil SMD 2x-dip-switch SPST Omron_A6S-210x, Slide, row spacing 25.4 mm (1000 mils), LongPads 42-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, LongPads THT DIP DIL PDIP 2.54mm 7.62mm 300mil PowerIntegrations variant of 8-Lead Plastic Dual Flat, No Lead Package - 3x3 mm Body [TQFP] With 4.5x4.5 mm Exposed Pad Variation; (see NXP sot054_po.pdf TO-92 leads molded, narrow, drill 0.75mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot519-1_po.pdf SSOP16: plastic shrink small outline package; 18 leads; body width 3.9 mm; lead pitch 0.65 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot190-1_po.pdf VSSOP-8 2.3x2mm Pitch 0.5mm http://chip.tomsk.ru/chip/chipdoc.nsf/Package/D8A64DD165C2AAD9472579400024FC41!OpenDocument VSON 10 Thermal on 11 3x3mm Pitch 0.5mm SON, 8-Leads, Body 5x6x1mm, Pitch 1.27mm; (see Texas Instruments HSOP 9, 1.27mm pitch, single row 0.8 mm Highspeed card edge connector for 1.6mm PCB's with 30 contacts (polarized Highspeed card edge card connector socket for 2.36mm PCBs, vertical (source: https://suddendocs.samtec.com/prints/hsec8-1xxx-xx-xx-dv-x-xx-footprint.pdf 0.8 mm Highspeed card edge connector for panel, 90° PCB mount 4 pin, 0.3mm round THT pads Net tie, 4 pin, 1.0mm round THT pads Net tie, 4 pin, 0.5mm square SMD pads Net tie, 4 pin, Right Angle, Surface Mount, Push-Pull Type, 1.42mm Height, with Detect Switch JST ACH series connector, S10B-PH-K (http://www.jst-mfg.com/product/pdf/eng/ePH.pdf), generated with.

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