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BackPitch 3.80mm diameter 8mm Electrolytic Capacitor CP, Axial series, Axial, Horizontal, pin pitch=20.32mm, , length*diameter=12.8*5.8mm^2, Fastron, HBCC, http://www.fastrongroup.com/image-show/18/HBCC.pdf?type=Complete-DataSheet&productType=series Inductor Axial series Axial Horizontal pin pitch 27.50mm length 31.5mm width 11mm Capacitor C, Disc series, Radial, pin pitch=7.50mm, , diameter=12.5mm, Electrolytic Capacitor CP, Axial series, Axial, Horizontal, pin pitch=5.08mm, , length*diameter=16*7.5mm^2, Fastron, XHBCC, http://www.fastrongroup.com/image-show/26/XHBCC.pdf?type=Complete-DataSheet&productType=series Inductor Axial series Axial Horizontal pin pitch 15.00mm length 16.5mm width 11.8mm Capacitor C, Rect series, Radial, pin pitch=6.00*6.00mm^2, , length*width=11.5*11.5mm^2, Neosid, NE-CPB-11EN, Drill1.3mm, http://www.neosid.de/produktblaetter/neosid_Festinduktivitaet_NE_CPB11EN.pdf Inductor Radial series Radial pin pitch 10.00mm diameter 8mm Diode, 5KP series, Axial, Horizontal, pin pitch=10.16mm, , length*diameter=4*2mm^2, , http://www.diodes.com/_files/packages/DO-35.pdf Diode DO-35_SOD27 series Axial Horizontal pin pitch 5.0mm, see https://diotec.com/tl_files/diotec/files/pdf/datasheets/b40r.pdf diode bridge ABS (Diotec), see https://diotec.com/tl_files/diotec/files/pdf/datasheets/abs2.pdf SMD package for Siemens SFH900 reflex photo interrupter coupler object detector Fiberoptic Reciver, RX, Toshiba, Toslink, TORX170, TORX173, TORX193, TORX194 Fiberoptic Reciver RX Toshiba Toslink TORX170 TORX173 TORX193 TORX194 IR Receiver Vishay TSOP-xxxx, CAST package, see https://www.vishay.com/docs/82493/tsop311.pdf package for diode bridges, row spacing 11.48 mm (451 mils 24-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), LongPads THT DIP DIL PDIP SMDIP 2.54mm 15.24mm 600mil SMDSocket SmallPads 40-lead though-hole mounted DIP package, row spacing 5.25 mm (206 mils), body size 10.8x6.64mm 2x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), LongPads 18-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), SMDSocket, LongPads 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 9.78x25.04mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile.
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