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System, 43045-1200 (alternative finishes: 43045-222x), 11 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-112-02-xx-DV-TE, 12 Pins (http://www.molex.com/pdm_docs/sd/022272021_sd.pdf), generated with kicad-footprint-generator JST PUD series connector, S32B-PUDSS-1 (http://www.jst-mfg.com/product/pdf/eng/ePUD.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-147-02-xxx-DV-A, 47 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Molex LY 20 series connector, S2P-VH (http://www.jst-mfg.com/product/pdf/eng/eVH.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py Texas Instruments, DSBGA, 0.9x1.9mm, 8 bump 3x3 array, NSMD pad definition Appendix A BGA 676 1 FF676 FFG676 FFV676 Kintex-7 and Zynq-7000 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=77, NSMD pad definition Appendix A BGA 324 0.8 CS325 CSG235 Spartan-7 BGA, 15x15 grid, 13x13mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=263, NSMD pad definition Appendix A Virtex-7 BGA, 42x42 grid, 42.5x42.5mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=280, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, 0.822x1.116mm, 5 bump 2x1x2 array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lmc555.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double rows Through hole pin header SMD 1x16 1.27mm single row Through hole socket strip THT 1x04 1.00mm single row (from Kicad 4.0.7), script generated Through hole pin header THT 2x25 2.00mm double row Through hole angled socket strip THT 2x19 2.00mm double row SMD IDC box header, 2x32, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Surface mounted pin header THT 2x35 1.00mm double row Through hole angled pin header THT 1x26 1.00mm single row Surface mounted socket strip THT 1x36 2.00mm single row Through hole angled socket strip THT 1x24 2.54mm single row Through hole IDC header, 2x17, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, https://www.tme.eu/Document/4baa0e952ce73e37bc68cf730b541507/T821M114A1S100CEU-B.pdf SMD vertical IDC box header, 2x05, 2.54mm pitch, single row style2 pin1 right Through hole straight Samtec HPM power header series 11.94mm post length THT 1x12 1.27mm single row style1 pin1 left Surface mounted pin header THT 2x09 1.00mm double row Through hole angled pin header SMD 1x20 2.00mm single row (from Kicad 4.0.7), script generated Surface mounted pin header THT 2x18 2.54mm double row surface-mounted straight socket strip, 1x28, 1.27mm pitch, 4.4mm socket length, double rows Through hole angled pin header SMD 2x11 2.00mm double row surface-mounted straight socket strip, 1x26, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Through hole vertical IDC header THT 2x09 2.54mm double row surface-mounted straight socket strip, 2x26, 1.27mm pitch, double.

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