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LY20-12P-DT1, 6 Circuits (http://www.jae.com/z-en/pdf_download_exec.cfm?param=SJ038187.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py MSOP, 8 Pin (https://ww2.minicircuits.com/case_style/XX211.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 40 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=297), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 5 times 0.5 mm² wires, basic insulation, conductor diameter 0.9mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-E 0.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_noLead_generator.py LFCSP, 32 Pin (JEDEC MO-194 Var AA https://www.jedec.org/document_search?search_api_views_fulltext=MO-194), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP, 16 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=266), generated with.

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