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Plastic SO, Exposed Die Pad (TI DDA0008B, see http://www.ti.com/lit/ds/symlink/lm3404.pdf 8-pin HTSOP package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm body, exposed pad, thermal vias.

• 10.0x5.0 RedFrequency MG/MT/MX series, http://www.red-frequency.com/download/datenblatt/redfrequency-datenblatt-ir-zta.pdf, length*width=10.0x5.0mm^2 package.
• 100644 Schematics/SynthMages.pretty/Switch.dcm create mode 100644 Hardware/PCB/precadsr/sym-lib-table create.
• 0.301613 -9.71631 3.26879 vertex -9.20539 3.813 2.94279.
• 2x17, 2.54mm pitch, 8.51mm socket length.
• Würth dual independently isolated BNC plug.

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