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22-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils), Socket 18-lead though-hole mounted DIP package, row spacing 15.24 mm.

• Pad definition Appendix A BGA 1760 1.
• 1aa48a179aa2fb0f2688991cbdf145da4cfe15db Mon Sep 17.
• At http://mozilla.org/MPL/2.0/. If it is if.

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