Labels Milestones
Back3x4 Layout, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf BGA 12 0.5 R-XBGA-N12 Texas Instruments, DSBGA, area grid, NSMD pad definition (http://www.ti.com/lit/ds/symlink/msp430f2234.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, 1.4715x1.4715mm, 9 bump 3x3 (perimeter) array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf Texas Instruments, DSBGA, area grid, NSMD pad definition Appendix A Artix-7 BGA, 18x18 grid, 15x15mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=95, NSMD pad definition Appendix A Zynq-7000 BGA, 20x20 grid, 17x17mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=306, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments EUS 5 Pin Double Sided Module Texas Instruments HSOP 9, 1.27mm pitch, single row Through hole angled pin header THT 2x37 2.54mm double row surface-mounted straight socket strip, 2x11, 2.00mm pitch, double rows Through hole angled pin header, 2x35, 2.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled pin header, 1x04, 1.27mm pitch, single row Through hole angled socket strip, 2x15, 2.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole socket strip THT 2x01 2.00mm double row Through hole straight pin header, 1x24, 2.00mm pitch, double rows Surface mounted pin header SMD 1x35 2.54mm single row (from Kicad 4.0.7), script generated Through hole angled socket strip, 2x07, 1.27mm pitch, single.
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