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CSG235 Spartan-7 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=268, NSMD pad definition Appendix A Zynq-7000 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=280, NSMD pad definition Appendix A BGA 324 0.8 GateMate FPGA Maxim WLP-12, W121H2+1, 2.008x1.608mm, 12 Ball, 3x4 Layout, 0.5mm Pitch, https://www.ti.com/lit/ds/symlink/dac80508.pdf Analog LFCSP, 16 Pin (https://www.nxp.com/docs/en/package-information/SOT758-1.pdf), generated with kicad-footprint-generator Molex Mini-Fit Jr. Power Connectors, old mpn/engineering number: 1-770190-x, 5 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-139-02-xxx-DV-A, 39 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex Micro-Fit 3.0 Connector System, 5267-04A, 4 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 6 times 1 mm² wires, reinforced insulation, conductor diameter 2.4mm, see , script-generated with , script-generated with , script-generated with , script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_MetzConnect THT terminal block Metz Connect Type011_RT05505HBWC pitch 5mm size 45x9mm^2 drill 1.3mm pad 2.5mm terminal block Metz Connect Type067_RT01905HDWC, 5 pins, pitch 5.08mm, revamped version of the Software. THE SOFTWARE OR THE USE OF THIS SOFTWARE. The MIT License (MIT) Copyright (c) 2013 Dustin Sallings Permission is hereby granted, free of charge, to any person obtaining a copy Copyright (c) 2019 - present, iVis@Bilkent. Permission is hereby granted, free of charge, to any person obtaining a copy The MIT License Permission is hereby granted, free of charge, to any person obtaining a copy The ISC License Copyright (c) 2009 The Go Authors. All rights reserved. Redistribution and use a ground plane Change transistor footprint to inline_wide, fix DRC ground plane created pull request 'new_footprints' (#5) from new_footprints into main 96f746fa2d Final tweaks, version submitted to JLCPCB on 20240124 3d279dd88c Finish schematic, add PDF Compare 3 commits » merged pull request 'More schematics' (#3) from schematic into main 96f746fa2d Final tweaks, version submitted to JLCPCB.

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