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Footswitch, DPDT, https://www.e-switch.com/system/asset/product_line/data_sheet/226/FS5700.pdf Switch with High Contact Reliability, Side-actuated Model, with Ground Terminal, without Boss Ultra-small-sized Tactile Switch with High Contact Reliability, Side-actuated Model, without Ground Terminal, with Boss Ultra-small-sized Tactile Switch SPST Slide 5.25mm 206mil JPin SMD 1x-dip-switch SPST Copal_CHS-01A, Slide, row spacing 9.53 mm (375 mils 6-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils 20-lead surface-mounted (SMD) DIP package, row spacing 11.43 mm (450 mils), SMDSocket, SmallPads 24-lead though-hole mounted DIP package, row spacing 5.9 mm (232 mils), body size (see https://www.omron.com/ecb/products/pdf/en-a6h.pdf SMD 4x-dip-switch SPST Omron_A6S-410x, Slide, row spacing 9.53 mm (375 mils), Clearance8mm 18-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), Socket THT DIP DIL PDIP 2.54mm 7.62mm 300mil 8-lead dip package, row spacing 15.24 mm (600 mils), Socket 12-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size 6.7x24.42mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD 12x-dip-switch SPST , Slide, row spacing 25.4 mm (1000 mils), Socket, LongPads 64-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), LongPads 6-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see https://www.omron.com/ecb/products/pdf/en-a6h.pdf SMD 6x-dip-switch SPST , Slide, row spacing 11.48 mm (451 mils 14-lead surface-mounted (SMD) DIP package, row spacing 9.53 mm (375 mils 12-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 24-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf 3M 40-pin zero insertion force socket, through-hole, row spacing 7.62 mm (300 mils), see https://ac-dc.power.com/sites/default/files/product-docs/tinyswitch-iii_family_datasheet.pdf Power Integrations variant of TO-92), also known as TO-226, wide, drill 0.75mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot552-1_po.pdf 14-Lead Plastic Dual Flat No-Lead Package, Body 4.4x6.5x1.1mm, Pad 3.0x4.2mm, Texas Instruments EUW 7 Pin (https://b2b-api.panasonic.eu/file_stream/pids/fileversion/2787), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 4 times 0.1 mm² wires, basic insulation, conductor diameter 0.4mm, outer diameter 1mm, size source Multi-Contact FLEXI-E 0.75 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times 2.5 mm² wire, reinforced insulation, conductor diameter 1.4mm, outer diameter 4.4mm, size source Multi-Contact FLEXI-xV 1.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_noLead_generator.py WDFN, 8 Pin (https://datasheet.lcsc.com/lcsc/2303241700_Zetta-ZDSD64GLGEAG-R_C5277948.pdf#page=17), generated with kicad-footprint-generator Molex Sabre Power Connector, 43160-1104, With thermal vias in pads, 4 Pins.

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