Labels Milestones
BackVias and counter-pad, see http://www.ti.com/lit/ds/symlink/tps62177.pdf WSON 0.5 thermal vias in pads, 2 Pins per row.
- Module, Patch on Top, https://www.quectel.com/UploadImage/Downlad/Quectel_L80-R_Hardware_Design_V1.2.pdf.
- Size 9.78x4.72mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile.