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ZIF 7.62mm 300mil 3-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 20-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 32-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 16-lead surface-mounted (SMD.

• 0.865125 0.246476 facet normal -6.870092e-01 7.266487e-01.
• 25.4x9.8mm^2 drill 1.3mm pad 2.5mm terminal.
• 0.331801 0.353615 0.874566 facet normal -0.0624761 0.0761267 0.995139.
• 0.635; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot371-1_po.pdf STC SOP.

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