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MOSFET package, 3x3mm (see https://www.fairchildsemi.com/datasheets/FD/FDMC8032L.pdf Fairchild-specific MicroPak-6 1.0x1.45mm Pitch 0.5mm Analog Devices (Linear Tech), 133-pin BGA uModule, 15.0x15.0x4.92mm, https://www.analog.com/media/en/technical-documentation/data-sheets/4637fc.pdf MAPBGA 9x9x1.11 PKG, 9.0x9.0mm, 272 Ball, 17x17 Layout, 0.8mm Pitch, https://www.st.com/resource/en/datasheet/stm32h7b3ri.pdf ST TFBGA-257, 10.0x10.0mm, 257 Ball, 19x19 Layout, 0.8mm Pitch, https://www.ti.com/lit/ml/mpbg777/mpbg777.pdf BGA 289 0.8 ZAV S-PBGA-N289 Texas Instruments, DSBGA, 3.415x3.535x0.625mm, 64 ball 8x8 area grid, NSMD, YZP0005 pad definition, 1.468x0.705mm, 8 Ball, 2x4 Layout, 0.4mm Pitch, YFF0006, NSMD pad definition Appendix A BGA 676 1 FF676 FFG676 FFV676 Kintex-7 and Zynq-7000 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=273, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=284, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=84, NSMD pad definition Appendix A Virtex-7 BGA, 42x42 grid, 42.5x42.5mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=302, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lmc555.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, double cols (from Kicad 4.0.7), script generated Through hole angled pin header, 2x34, 1.27mm pitch, single row style2 pin1 right Through hole straight pin header, 1x06, 1.27mm pitch, double rows Through hole angled pin header, 2x30, 2.54mm pitch, single row style1 pin1 left Surface mounted socket strip SMD 2x16 1.27mm double row surface-mounted straight pin header, 2x13, 2.54mm pitch, 8.51mm socket length, double cols (from Kicad 4.0.7), script generated Through hole angled pin header SMD 1x33 1.27mm single row style2 pin1 right Through hole angled socket strip, 2x08, 1.27mm pitch, single row Surface mounted socket strip SMD 2x06 1.00mm double row Through hole socket strip SMD Solder 3-pad Jumper, 1x1.5mm Pads, 0.3mm gap, pads 1-2 bridged with 1 copper strip SMD 2x35 1.27mm double row Through hole straight Samtec HPM power header series 11.94mm post length THT 1x09 5.08mm single row Surface mounted socket strip SMD 1x07 1.27mm single row Surface mounted socket strip SMD 1x30 1.00mm single row (from Kicad 4.0.7), script generated Through hole angled pin header THT 2x13 2.00mm double row surface-mounted straight socket strip, 1x03, 1.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled pin header, 1x31, 2.00mm pitch, 6.35mm socket length, single row style2 pin1 right Through hole straight pin header, 2x04, 1.00mm pitch, 2.0mm pin length, single row Surface mounted socket strip SMD 1x18 1.27mm single row style2 pin1 right Through hole angled pin header THT 2x31 2.00mm double row Through hole straight socket strip, 2x01, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated.

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