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FFG676 FFV676 Kintex-7 and Zynq-7000 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=261, NSMD pad definition Appendix A BGA 484 0.8 SBG485 SBV485 LFCSP, exposed pad, Analog Devices (http://www.analog.com/media/en/technical-documentation/data-sheets/ADL5542.pdf LFCSP 8pin thermal pad (CP-16-22, http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp_16_22.pdf LFCSP, 16 Pin (https://assets.nexperia.com/documents/data-sheet/74HC_HCT165.pdf#page=14), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-119-02-xx-DV-TE, 19 Pins per row (http://www.molex.com/pdm_docs/sd/431605304_sd.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55935-1330, 13 Pins (http://www.farnell.com/datasheets/2157639.pdf), generated with kicad-footprint-generator JST ZE series connector, SM17B-SURS-TF (http://www.jst-mfg.com/product/pdf/eng/eSUR.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-106-02-xxx-DV-LC, 6 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 5 times 0.5 mm² wires, basic insulation, conductor diameter 1.4mm, outer diameter 3.6mm, size source Multi-Contact FLEXI-E/HK 0.127 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_gullwing_generator.py TSOP I, 32 pins, 18.4x8mm body (https://www.micron.com/~/media/documents/products/technical-note/nor-flash/tn1225_land_pad_design.pdf TSOP-I, 56 Pin (http://intantech.com/files/Intan_RHD2000_series_datasheet.pdf#page=38), generated with kicad-footprint-generator ipc_noLead_generator.py DFN, 8 Pin (http://www.ti.com/lit/ml/mpds400/mpds400.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py MSOP, 16 Pin (http://www.intersil.com/content/dam/Intersil/documents/l16_/l16.5x5.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 28 Pin (https://www.akm.com/akm/en/file/datasheet/AK5394AVS.pdf#page=23), generated with StandardBox.py) (https://product.tdk.com/info/en/catalog/datasheets/inductor_automotive_power_slf10145-h_en.pdf Inductor, TDK, SLF7045, 7.0mmx7.0mm (Script generated with kicad-footprint-generator Molex Molex 1.00mm Pitch Easy-On BackFlip Type FFC/FPC, 502250-2391, 23 Circuits (http://www.molex.com/pdm_docs/sd/5022502391_sd.pdf), generated with kicad-footprint-generator LED SMD 1206 Mini-Circuits Filter SMD 1206 https://ww2.minicircuits.com/case_style/FV1206-7.pdf SMD Type 10.7MHz Ceramic Filter https://www.murata.com/en-us/products/filter/cerafil/sfecf 6-pin 3.8 x 3.8mm SAW filter package based on either internal or external clock sources cycle between 0v and 5v max // gate out (j4/j10) // clock out (j5/j12 // glide in (j16/j17) // cv out (j7/j6) // pause (j18/j19 // 10 steps (sw1-sw10) // 1 for run/stop (sw14 // 1 for manual reset (sw16 // clock in (j2/j11 // casc out (j14/j15) // reset/casc in (j1/j13) // gate out (j4/j10) // clock in (j2/j11) // casc out (j14/j15 // reset/casc in (j1/j13 // gate out (j4/j10) // clock in (j2/j11 // casc out (j14/j15) // reset/casc in (j1/j13 // gate out (j4/j10 // clock in (j2/j11 // casc out (j14/j15 // reset/casc in (j1/j13) // gate out (j4/j10) // clock out (j5/j12) // glide in (sleeve and normal both GND - Gate out (could normal to TP10, optional 2x Toggle Switches, 3pin: - CV out, with probably +12v.

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