Labels Milestones
BackMD MOSFET Infineon DirectFET MB MOSFET Infineon DirectFET S1 MOSFET Infineon DirectFET SC MOSFET Infineon DirectFET S3C MOSFET Infineon DirectFET MU MOSFET Infineon DirectFET ST MOSFET Infineon PLCC, 20 pins, through hole M2, height 2, Wuerth electronics 9771150360 (https://katalog.we-online.com/em/datasheet/9771150360.pdf), generated with kicad-footprint-generator Molex PicoBlade series connector, 53261-0371 (http://www.molex.com/pdm_docs/sd/532610271_sd.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole 2.7mm, height 6.5, Wuerth electronics 9774040360 (https://katalog.we-online.de/em/datasheet/9774040360.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: 26-60-5110, 11 Pins (https://www.molex.com/pdm_docs/sd/026604020_sd.pdf), generated with kicad-footprint-generator Molex Micro-Fit 3.0 Connector System, 5267-05A, 5 Pins per row (http://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=82181_SOFTSHELL_HIGH_DENSITY&DocType=CS&DocLang=EN), generated with kicad-footprint-generator Fuse SMD 2512 (6332 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size from: http://www.kemet.com/Lists/ProductCatalog/Attachments/253/KEM_TC101_STD.pdf), generated with kicad-footprint-generator JST ZE series connector, S7B-PH-K (http://www.jst-mfg.com/product/pdf/eng/ePH.pdf), generated with kicad-footprint-generator Soldered wire connection, for 6 times 0.1 mm² wires, reinforced insulation, conductor diameter 0.48mm, outer diameter 1mm, size source Multi-Contact FLEXI-E 0.15 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator JST PUD series connector, S16B-PUDSS-1 (http://www.jst-mfg.com/product/pdf/eng/ePUD.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-119-02-xxx-DV-BE, 19 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with.
- DIP-8/SOIC-8/TO-99-8 | | | | C1.
- - Consider adding larger pads.
- For: MC_1,5/2-GF-3.81; number of pins: 02; pin.