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HLE-126-02-xxx-DV-BE-A, 26 Pins per row (https://www.molex.com/pdm_docs/sd/430450201_sd.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-0530, 5 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator connector wire 0.25sqmm strain-relief Soldered wire connection, for 4 times 0.127 mm² wires, basic insulation, conductor diameter 0.4mm, outer diameter 3.5mm, size 46.5x8.3mm^2, drill diamater 1.15mm, pad diameter 2.5mm, see http://cdn-reichelt.de/documents/datenblatt/C151/RND_205-00298_DB_EN.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_WAGO THT Terminal Block WAGO 804-301, 45Degree (cable under 45degree), 11 pins, pitch 5.08mm, size 25.4x10.6mm^2, drill diamater 1.3mm, pad diameter 2.5mm.

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