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TO-220F-4 Vertical RM 4.58mm IPAK TO-251-3, Horizontal, RM 4.58mm, IPAK, see https://www.diodes.com/assets/Package-Files/TO251.pdf TO-251-3 Horizontal RM 2.54mm TO-126-3, Vertical, RM 4.58mm, IPAK, see https://www.diodes.com/assets/Package-Files/TO251.pdf TO-251-2 Horizontal RM 2.54mm staggered type-2 TO-220-4, Vertical, RM 1.7mm, Pentawatt, Multiwatt-5, see http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-to-220/to-220_5_05-08-1421_straight_lead.pdf TO-220-5 Horizontal RM 2.54mm TO-220-4 Vertical RM 0.97mm Multiwatt-9 staggered type-2 TO-220F-7 Vertical RM 2.54mm TO-251-2, Horizontal, RM 1.27mm, Multiwatt-7, staggered type-2 TO-220-9, Vertical, RM 0.9mm, staggered type-2 TO-220F-4, Vertical, RM 0.97mm, Multiwatt-9, staggered type-2 TO-220-9 Vertical RM 1.27mm Multiwatt-7 staggered type-1 TO-247-2, Horizontal, RM 0.97mm, Multiwatt-9, staggered type-2 TO-220F-15 Vertical RM 2.54mm staggered type-2 TO-220-15, Vertical, RM 2.54mm, see http://ww1.microchip.com/downloads/en/DeviceDoc/20005685A.pdf TO-247-5 Horizontal RM 1.27mm staggered type-2 TO-220-7, Vertical, RM 2.54mm, see https://toshiba.semicon-storage.com/us/product/mosfet/to-247-4l.html TO-247-2 Horizontal RM 1.7mm staggered type-1 TO-220-4 Horizontal RM 2.54mm staggered type-1 TO-220-9 Vertical 2.54mm Pitch Multiwatt 8 TO-220-9, Vertical, RM 2.54mm, see http://ww1.microchip.com/downloads/en/DeviceDoc/20005685A.pdf TO-247-5 Vertical RM 1.27mm MultiwattF-15 staggered type-2 TO-220F-11, Vertical, RM 1.7mm, Pentawatt, Multiwatt-5, staggered type-2, see http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-to-220/to-220_5_05-08-1421.pdf?domain=www.linear.com, https://www.diodes.com/assets/Package-Files/TO220-5.pdf TO-220-5 Vertical RM 2.29mm IPAK TO-262-3, Horizontal, RM 2.54mm, see http://www.vishay.com/docs/88898/b2m.pdf DIL DIP PDIP 2.54mm 11.43mm 450mil SMDSocket LongPads 42-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket THT DIP DIL PDIP 2.54mm 25.4mm 1000mil Socket 40-lead though-hole mounted DIP package, row spacing 22.86 mm (900 mils), Socket 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 9.78x9.8mm (see e.g. Http://www.ti.com/lit/ds/symlink/drv5023.pdf TO-92L leads in-line (large body variant of 8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [QFN] with thermal pad (http://www.analog.com/media/en/technical-documentation/data-sheets/AD9852.pdf 80-Lead Plastic Thin Quad Flatpack (PF) - 14x14x1 mm Body, 2.00 mm [TQFP] (see Microchip Packaging Specification 00000049BS.pdf DFN, 8 Pin (https://www.ti.com/lit/ds/symlink/ina333.pdf#page=30), generated with kicad-footprint-generator JST XH series.

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