3
1
Back

Exported BOM files *.xml *.csv # KiCad backups folders *-backups # Compressed files *.zip # Mac stuff *.DS_Store # Emacs temps *~ \#* # LTSpice Simulations/*.log Simulations/*.raw Simulations/*.txt Copper Layer Stackup: T5 15.200mm 0.5984" (1 hole) Total plated holes unplated through holes: ============================================================= T1 3.200mm 0.1260" (4 holes) (with 4 slots) T2 5.000mm 0.1969" (1 hole) Total plated holes Total unplated holes count 16 Not plated through holes are merged with plated holes count 16 Not plated through holes: unplated through holes: ============================================================= d952ec97f3d5e1172c33dcefe438ee5d18f8d87d Start of LM13700 version to see why 5ff3077e8252367b7eceb0b21b0803904b695d42 0d3d72c49e606725216a5a9a4217e6c039d5a574 9060b76361734f9abf9a1c676dd9110e9ced917b initial kicad project initial kicad project main MK_SEQ/.gitignore 3 lines Creative Commons Legal Code CC0 1.0 Universal CREATIVE COMMONS CORPORATION IS NOT A LAW FIRM AND DOES NOT CREATE AN ATTORNEY-CLIENT RELATIONSHIP. CREATIVE COMMONS CORPORATION IS NOT A LAW FIRM AND DOES NOT.

New Pull Request